JPH0534121Y2 - - Google Patents

Info

Publication number
JPH0534121Y2
JPH0534121Y2 JP1987173546U JP17354687U JPH0534121Y2 JP H0534121 Y2 JPH0534121 Y2 JP H0534121Y2 JP 1987173546 U JP1987173546 U JP 1987173546U JP 17354687 U JP17354687 U JP 17354687U JP H0534121 Y2 JPH0534121 Y2 JP H0534121Y2
Authority
JP
Japan
Prior art keywords
led
epoxy resin
chmsl
light
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987173546U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0178059U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987173546U priority Critical patent/JPH0534121Y2/ja
Publication of JPH0178059U publication Critical patent/JPH0178059U/ja
Application granted granted Critical
Publication of JPH0534121Y2 publication Critical patent/JPH0534121Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
JP1987173546U 1987-11-12 1987-11-12 Expired - Lifetime JPH0534121Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987173546U JPH0534121Y2 (en]) 1987-11-12 1987-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987173546U JPH0534121Y2 (en]) 1987-11-12 1987-11-12

Publications (2)

Publication Number Publication Date
JPH0178059U JPH0178059U (en]) 1989-05-25
JPH0534121Y2 true JPH0534121Y2 (en]) 1993-08-30

Family

ID=31465450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987173546U Expired - Lifetime JPH0534121Y2 (en]) 1987-11-12 1987-11-12

Country Status (1)

Country Link
JP (1) JPH0534121Y2 (en])

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6816481B1 (en) 1999-04-09 2004-11-09 Sbc Technology Resources, Inc. Internet caller identification system and method
JP2003197976A (ja) * 2001-12-27 2003-07-11 Okaya Electric Ind Co Ltd 発光ダイオード
US6718021B2 (en) 2002-02-19 2004-04-06 Sbc Properties, L.P. Method and system for presenting customized call alerts in a service for internet caller identification

Also Published As

Publication number Publication date
JPH0178059U (en]) 1989-05-25

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